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词汇
Die attach or chip bonding
释义
Die attach or chip bonding
基本
例句
芯片贴装
Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
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更新时间:2026/8/9 6:30:37