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词汇
directly wafer bonding
释义
directly wafer bonding
基本
例句
晶片直接键合
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
摘要晶片直接键合技术是材料集成的一项新工艺,是近年来集成光电子领域的研究热点之一。
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smag
S MAG
S-MAG
Smage
Smagghe
Smaghi
Smagin
Smagliyenko
Smagon
smagulovich
Smaha
Smai
s maid
smacking of
smackings
smack in the center
smack in the eye
smack in the face
smack in the middle of
smack into
smack/lick your lips
smackly
Snezhnaya, Gora
Snezhnevski
Snezhnevskiy
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更新时间:2026/6/24 9:31:30